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High Thermal Conductivity Ceramic Substrate Aluminum Nitride AlN Ceramic Substrate

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High Thermal Conductivity Ceramic Substrate Aluminum Nitride AlN Ceramic Substrate

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Brand Name : zmkj

Model Number : AlN

Place of Origin : CHINA

MOQ : 25pcs

Price : by case

Delivery Time : 10-20days

Packaging Details : 25pcs cassette box

Material : AlN ceramic substrates

applications : ceramic plates for semiconductor processing

color : white or red or blue

size : 3-8inch

Purity : 98%

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Aluminum Nitride AlN Ceramic Substrate, High Thermal Conductivity

0.5mm AlN Ceramic,6inch ceramic substrates

AlN Introduce

The aluminum nitride (AlN) ceramic has high thermal conductivity (5-10 times as the alumina ceramic),

low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance,chemical resistance, and the linear expansion coefficient is similar with Si.

As a new generation of ceramic material,AlN ceramic attracts more and more attention. In the leading

level of domestic enterprises’, the quality of our company AlN ceramic substrate reaches the international advanced level. It is widely used in communication components, high power led, power electronic devices and other fields.

Our cooperating factory can applied the casting-tape process for the manufacturing of alumina substrate. With good thermal conductivity, insulation, thermal shock resistance, well resistance and anti-acid and alkali etc., our ceramic substrates can be used in thick-film hybrid integrated circuits (HIC), LED ceramic radiating base, power module, semiconductor devices and other fields.

AlN Feature & Advantagement

- Product Name:

Aluminium Nitride / AIN Ceramic Substrate

- Material: Aluminum Nitride / AlN
- Typical Characteristics:

1. Very High Thermal Conductivity

2. Good Electrical Insulation

3. Corrosion Resistance

4. Good Flatness

- Typical Applications:

1. Power Electronic Device

2. High Brightness LED

3. Communication Device

Material Properties
Properties / Material 96% Alumina AlN
Density (g/cm3) 3.6 3.3
Color White Grey
Dielectric Strength (KV/mm) ≥17 ≥17
Dielectric Constant (1MHz) 10.6 8.9
Volume Resistivity (@20°C, Ω.cm) ≥1014 ≥1014
Thermal Conductivity (@20°C, W/mk) ≥24 ≥175
Thermal Expansion Coefficient (10-6/°C) 6.5-8.0 4.8
Flexural Strength (MPa) ≥350 ≥450

Regular Size
Thickness(mm) lengthx width ( mm)
0.385

2″* 2″

50.8mm*50.8mm

3″* 3″

76.2mm*76.2mm

4″* 4″

101.6mm*101.6mm

4.5″* 4.5″

114.3mm*114.3mm

0.5
0.635
1.0
diameter(mm)
1.0

Φ16

Φ19

Φ20

Φ26

Φ30

Φ35

Φ40

Φ45

Φ50

Φ52

Φ60 Φ75 Φ80
1.2
1.5
2.0
2.5
Diameter (mm) Thickness (mm)

2''

(50.8mm )

OF 16mm

3''

(76.2mm)

OF22mm

4''

(100mm)

OF 30mm

5“

(125mm)

OF 42.5mm

6"

(150mm)

OF 47.5mm

0.385
0.5
0.65
1.0

Polishing Service

Our AlN substrate can be polished(single and double polish) by the advanced machine which imported

from abroad. Ceramic substrate surface roughness can reach to 1nm without porous after being polished.

It is perfectly suitable for the device application of small spec, high precision , wiring density and good stability.

High Thermal Conductivity Ceramic Substrate Aluminum Nitride AlN Ceramic SubstrateHigh Thermal Conductivity Ceramic Substrate Aluminum Nitride AlN Ceramic Substrate

Package & Delivery

High Thermal Conductivity Ceramic Substrate Aluminum Nitride AlN Ceramic Substrate


Product Tags:

silicon carbide ceramic

      

alumina ceramic substrate

      
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